Adjustment Method of MEMS Dual-Cantilever Deflection Using Plastic Deformation of Al and Ni Thin Film by Thermal Annealing

Deflection mismatch exists in microelectromechanical systems (MEMSs) cantilevers. To adjust for this mismatch, we devised a method to form Al and Ni films on the cantilever adjusted film stress by thermal annealing at low temperature short duration. Thus, of was successfully 150–400 °C 1–5 min. During process, compressive caused expansion 150 or higher led plastic deformation, resulting an enhanced tensile state after cooling. The changed from side 200–400 1–30 min because shrinkage crystallization crystalline orientation during process.